MACOM to Showcase New Products at Optical Networks and Communications Conference
LOWELL, Mass .– (BUSINESS WIRE) – MACOM Technology Solutions Inc. (“MACOM”) announced today that it will host three live demonstrations and four technical conferences the week of the Fiber Optic Communication (OFC) Conference and Exhibition, 7-10 June 2021.
Demonstrations and technical interviews will be hosted by MACOM’s optical and high-speed data design, product management and application engineering teams. Customers will have the opportunity to ask questions and interact with MACOM staff during the demonstrations. To schedule a demonstration or attend a technical conference, please contact MACOM sales or email email@example.com.
OFC 2021 live video demonstrations include:
DEMO # 1: 200G and 400G analog chipsets for Data Center
MACOM will demonstrate a two-chip analog solution for short-range QSFP 200G and OSFP 400G, as well as QSFP-DD modules and AOC data center applications. The first chip is a PAM-4 CDR and TIA 4x53Gbps, and the second is a PAM-4 CDR and VCSEL 4x53Gbps driver. The chipset will demonstrate IEEE compliant bit error rate (BER) performance and Open Eye MSA transmission ocular compliance, while displaying interoperability with an Ethernet switch.
DEMO # 2: 50G benchmark design for 5G wireless medium transport applications
MACOM will demonstrate its 50G benchmark design for mid-range 5G wireless applications. This demonstration will include a complete 50G PAM-4 QSFP28 reference design, using all MACOM components. The demonstration platform is a 20 kilometer optical link with a single mode fiber using a wavelength of 1310 nanometers. The benchmark design features MACOM’s new PRISM-50D DSP with integrated DML driver, a 26 Gigabaud 1310 I-temp laser, 26 Gbp PIN photodiode, and a 26 Gb PAM-4 TIA.
DEMO # 3: DWDM laser performance for 5G front and mid-range applications
MACOM will demonstrate its 25G DFB lasers at DWDM wavelengths, along with its Driver, CDR, TIA and Photodiode offerings in a transceiver designed for South Korea Telecom applications. This demo will show the performance on a 20 kilometer link.
OFC 2021 Live Technical Discussions (Technical Discussions) include:
TECH TALK # 1: Using MACOM 64 Gb Flip-Chip ICs for 400ZR Applications
This presentation will highlight MACOM’s 64 GBaud toggle chip driver and TIA ICs targeted for 400ZR applications. As the industry continues to migrate to smaller form factor, more tightly packaged cohesive modules, the need to use flip-flop chip assembly techniques becomes more prevalent. In this talk, MACOM will present the performance of our 64 GBaud and TIA quad-channel driver, while highlighting the advantages and disadvantages of using these integrated circuits in a flip-chip format.
TECHNICAL TALK # 2: Modeling and Optimizing the 50G PAM-4 Transmitter Using DML
This presentation will cover modeling a complete data transmission path from MACOM’s PRISM-50D DSP with integrated DML driver, PCB, FPC and DML TO-CAN. Using the model, the impact of various system elements on an end-to-end link can be understood and refined to achieve targeted transmitter performance. In this talk, measurements from a real system will be used to support the simulation data. MACOM will discuss the main considerations for designing transmitters using DMLs and how to implement module designs using the PRISM-50D DSP with built-in MACOM DML driver.
TECHNICAL TALK # 3: Key Considerations for DML and 25 GBaud Drivers
This presentation will highlight the electrical performance of MACOM’s DML 28 GBaud drivers as well as optical performance alongside MACOM’s DML 25G. In this talk, MACOM will review the performance of various high speed drivers, while highlighting key application issues to help integrate these drivers into module assemblies.
TECHNICAL TALK # 4: 100G direct drive per channel: the way to less power 100G PAM interfaces
MACOM will present the advantages of a 100G linear architecture for network connectivity applications. This presentation will present measurements and simulations highlighting the power and cost reductions made possible by this approach.
To schedule a demo or attend a technical conference, please contact MACOM sales or email us at firstname.lastname@example.org. We invite our customers to a video conference with MACOM engineers to find out how our new products enable next-generation PON, wireless and wireline telecommunications, and high-speed cloud data centers.
MACOM designs and manufactures semiconductor products for telecommunications, industrial and defense and data center applications. Based in Lowell, Massachusetts, MACOM has design centers and sales offices in North America, Europe and Asia. MACOM is certified under ISO9001 international quality standard and ISO14001 environmental management standard.
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